Chip Scale Vacuum Packaging for Uncooled IRFPA
نویسندگان
چکیده
منابع مشابه
Uncooled amorphous silicon 1⁄4 VGA IRFPA with 25 μm pixel-pitch for High End applications
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from amorphous silicon layer enables ULIS to develop 384 x 288 (1⁄4 VGA) IRFPA formats with 25 μm pixel-pitch designed for high end applications. This detector ROIC design relies on the same architecture as the full TV format ROIC one (detector configuration by serial link, user defined amplifier gain,...
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The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from an amorphous silicon layer enables ULIS to develop 384 x 288 (1⁄4 VGA) IRFPA format with 25 μm pixel-pitch designed for low end application. This detector has kept all the innovations developed on the full TV format ROIC (detector configuration by serial link, low power consumption or wide electri...
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ژورنال
عنوان ژورنال: IEEJ Transactions on Fundamentals and Materials
سال: 2007
ISSN: 0385-4205,1347-5533
DOI: 10.1541/ieejfms.127.405